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NANOPACK Nano Packaging Technology for Interconnect and Heat Dissipation
www.nanopack-project.com - 2009-02-11
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Enertron Inc. - The Total Thermal and Heat Sink Solution Specialist, Thermal and Heat Sink Design, Heat Sink and Heat Pipe Manufacturing, Custom Thermal ...
Enertron  heatpipe cooling  heat sink solutions  peltier heat sink  thermal electric cooler 
www.enertron-inc.com - 2009-02-07
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Amulaire, a thermal management company, uses its extensive expertise in material science to respond to the heat issues faced by today's semiconductor companies, ...
semiconductor heat 
www.amulaire.com - 2009-02-09
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Remetal, remetal llc, carfal, AlN, aluminum nitride, ceramic substrate, metallized ceramic, ceramic package, direct bond copper, DBC copper, DBC, carbon fiber, ...
aluminum-silicon  carbon fiber aluminum  carfal  composite baseplate  copper molly  DBC copper  diamond aluminum  diamond composite  diamond copper  package baseplate  processor lid  remetal llc  silicon-aluminum 
www.remetal-llc.com - 2009-02-07
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TJK Technologies, Sydney, Australia, supply interface materials to cool electronic assemblies and materials to transfer heat offers such as Heat Transfer Pads, ...
Anti-static solutions  Bond Ply  Heat Transfer Pads  Insulating Metal Substrates  Static Cleaning  T-Clad Thermal Clad 
www.tjk.com.au - 2009-02-12
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Offering thermal management of electronics, telecommunications equipment, computers. Products include thermal management controllers, fan trays, airflow sensors ...
Airflow cooling  Baffles Sensors  Board Mounted Sensors  Custom Thermal Design  Custom Thermal Engineering  Degree Cooling  non airflow sensors  thermal Ventilation  Thermal Verification 
www.degreec.com - 2009-02-07
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CoolBlast® fan unit by Knürr
www.cool-blast.com - 2009-02-07
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The first truly portable laptop stand. High quality stainless steel construction and ergonomically designed for comfortable desktop computing. Improved heat ...
www.xtstand.com - 2009-02-07
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Chippower is developing a new power supply architecture for telecom and computer based products for low voltage, high current applications.
CO Grounding  Energy supply architecture  High Frequency AC  Multiple output voltage  Power Foot-prints  Sub-volt  Transient Response 
www.chippower.com - 2009-02-04
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Acelent Technologies is a pioneer in Material Injection Molding of steels, iron, copper, ceramics and polymers. We customize materials and manufacturing ...
Copper Injection Moulding  Material Injection Molding  Precision metal part 
www.acelent-tech.com - 2009-02-07
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